dt-bindings: interconnect: qcom: document the RPMh Network-On-Chip interconnect in Maili SoC

Document the RPMh Network-On-Chip interconnect for the Qualcomm Maili
SoC.

Co-developed-by: Odelu Kukatla <odelu.kukatla@oss.qualcomm.com>
Signed-off-by: Odelu Kukatla <odelu.kukatla@oss.qualcomm.com>
Signed-off-by: Raviteja Laggyshetty <raviteja.laggyshetty@oss.qualcomm.com>
Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@oss.qualcomm.com>
Link: https://patch.msgid.link/20260622-maili_icc-v2-1-18b5ac08c04f@oss.qualcomm.com
Signed-off-by: Georgi Djakov <djakov@kernel.org>